The machine is designed to separate in the automatic mode of mounted elements and solder from electronic printed circuit boards.
The process of separating attachments and solder is carried out by:
supply of controlled heat to the board, which is transported through the working area;
vibrations that induce parts to fall off the board and are displayed in a separate drift.
The machine allows to separate elements from boards with a maximum size of 400x400 mm and height with hinged elements up to 60mm.
The equipment is a sectional steel frame structure on which a stainless steel chamber and heating elements are installed.
The safety factor for materials, bearing units and drive elements ensures a long service life even in severe operating conditions.
frequency converters to adjust the performance and temperature in the working chamber;
lining with heat-resistant materials;
special execution of the transporting nodes;
cooling system of the working chamber;
aspiration connection system;
gravity feeder with gravity to improve the cleaning of the board from the hinged elements.
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